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MOQ: | 100 piece |
Price: | negotiations |
Standard Packaging: | Cartons |
Delivery Period: | 5-8 work days |
Payment Method: | Payment Terms T/T, Western Union |
Supply Capacity: | 50000 pcs per months |
The assembly of BGA components is a complex process that requires precision and accuracy. The BGA components have small solder balls that are attached to the underside of the chip. These solder balls make contact with the PCB through a grid of pads that are located on the surface of the board. The BGA chip assembly is then heated so that the solder balls melt and bond with the pads on the PCB.
The BGA PCB Assembly offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, which means that more components can be placed on one circuit board. This reduces the size and weight of the device, making it more compact and portable. The BGA components are also more reliable than other types of components. They have a lower susceptibility to damage from thermal stress and mechanical shock.
The BGA PCB Assembly is a popular choice for electronic manufacturers because it is cost-effective. The BGA components are smaller and require less material to produce, reducing the cost of production. The BGA PCB Assembly is also easier to manufacture because the components are placed on the surface of the board, making it easier to inspect and test.
The BGA PCB Assembly is commonly used in a variety of electronic devices such as laptops, computers, smartphones, and gaming consoles. These devices require a compact and portable design, making the BGA PCB Assembly the perfect choice for manufacturers. The BGA PCB Assembly is also used in medical devices, automotive electronics, and aerospace systems.
In conclusion, the BGA PCB Assembly or Ball Grid Array PCB Assembly is a type of surface mount technology that offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, are more reliable, and are cost-effective. The BGA PCB Assembly is commonly used in electronic devices such as computers, laptops, and smartphones. It is also used in medical devices, automotive electronics, and aerospace systems. The BGA PCB Assembly is the perfect choice for manufacturers who require a compact and portable design.
Product Attribute | Description |
---|---|
Product Name | BGA Integrated Circuit Assembly |
Product Type | BGA Printed Circuit Board Assembly |
Assembly Type | BGA Electronic Assembly |
The BGA PCB Assembly product technical support and services include:
Our goal is to provide comprehensive support and services to ensure the success of your project and the satisfaction of your customers.
Product Packaging:
Shipping:
Q: What is the model number of the BGA PCB Assembly product?
A: The model number of our BGA PCB Assembly product is PCBA.
Q: Where is the BGA PCB Assembly product manufactured?
A: Our BGA PCB Assembly product is manufactured in Dongguan, China.
Q: What is the brand name of the BGA PCB Assembly product?
A: The brand name of our BGA PCB Assembly product is CHANLONG.
Q: What certifications does the BGA PCB Assembly product have?
A: Our BGA PCB Assembly product is certified with IATF16949 and ROHS.
Q: What are the packaging details of the BGA PCB Assembly product?
A: The BGA PCB Assembly products are packaged in cartons.
Q: What is the minimum order quantity for the BGA PCB Assembly product?
A: The minimum order quantity for our BGA PCB Assembly product is 100 pieces.
Q: What is the delivery time for the BGA PCB Assembly product?
A: The delivery time for our BGA PCB Assembly product is 5-8 working days.
Q: What are the payment terms for the BGA PCB Assembly product?
A: The payment terms for our BGA PCB Assembly product are T/T and Western Union, and prices are negotiable.
![]() |
MOQ: | 100 piece |
Price: | negotiations |
Standard Packaging: | Cartons |
Delivery Period: | 5-8 work days |
Payment Method: | Payment Terms T/T, Western Union |
Supply Capacity: | 50000 pcs per months |
The assembly of BGA components is a complex process that requires precision and accuracy. The BGA components have small solder balls that are attached to the underside of the chip. These solder balls make contact with the PCB through a grid of pads that are located on the surface of the board. The BGA chip assembly is then heated so that the solder balls melt and bond with the pads on the PCB.
The BGA PCB Assembly offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, which means that more components can be placed on one circuit board. This reduces the size and weight of the device, making it more compact and portable. The BGA components are also more reliable than other types of components. They have a lower susceptibility to damage from thermal stress and mechanical shock.
The BGA PCB Assembly is a popular choice for electronic manufacturers because it is cost-effective. The BGA components are smaller and require less material to produce, reducing the cost of production. The BGA PCB Assembly is also easier to manufacture because the components are placed on the surface of the board, making it easier to inspect and test.
The BGA PCB Assembly is commonly used in a variety of electronic devices such as laptops, computers, smartphones, and gaming consoles. These devices require a compact and portable design, making the BGA PCB Assembly the perfect choice for manufacturers. The BGA PCB Assembly is also used in medical devices, automotive electronics, and aerospace systems.
In conclusion, the BGA PCB Assembly or Ball Grid Array PCB Assembly is a type of surface mount technology that offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, are more reliable, and are cost-effective. The BGA PCB Assembly is commonly used in electronic devices such as computers, laptops, and smartphones. It is also used in medical devices, automotive electronics, and aerospace systems. The BGA PCB Assembly is the perfect choice for manufacturers who require a compact and portable design.
Product Attribute | Description |
---|---|
Product Name | BGA Integrated Circuit Assembly |
Product Type | BGA Printed Circuit Board Assembly |
Assembly Type | BGA Electronic Assembly |
The BGA PCB Assembly product technical support and services include:
Our goal is to provide comprehensive support and services to ensure the success of your project and the satisfaction of your customers.
Product Packaging:
Shipping:
Q: What is the model number of the BGA PCB Assembly product?
A: The model number of our BGA PCB Assembly product is PCBA.
Q: Where is the BGA PCB Assembly product manufactured?
A: Our BGA PCB Assembly product is manufactured in Dongguan, China.
Q: What is the brand name of the BGA PCB Assembly product?
A: The brand name of our BGA PCB Assembly product is CHANLONG.
Q: What certifications does the BGA PCB Assembly product have?
A: Our BGA PCB Assembly product is certified with IATF16949 and ROHS.
Q: What are the packaging details of the BGA PCB Assembly product?
A: The BGA PCB Assembly products are packaged in cartons.
Q: What is the minimum order quantity for the BGA PCB Assembly product?
A: The minimum order quantity for our BGA PCB Assembly product is 100 pieces.
Q: What is the delivery time for the BGA PCB Assembly product?
A: The delivery time for our BGA PCB Assembly product is 5-8 working days.
Q: What are the payment terms for the BGA PCB Assembly product?
A: The payment terms for our BGA PCB Assembly product are T/T and Western Union, and prices are negotiable.