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Professional BGA PCB Assembly for Optimal Performance and Reliability

Professional BGA PCB Assembly for Optimal Performance and Reliability

MOQ: 100 piece
Price: negotiations
Standard Packaging: Cartons
Delivery Period: 5-8 work days
Payment Method: Payment Terms T/T, Western Union
Supply Capacity: 50000 pcs per months
Detail Information
Place of Origin
Dongguan
Brand Name
CHANLONG
Certification
IATF16949/ROHS
Model Number
PCBA
Minimum Order Quantity:
100 piece
Price:
negotiations
Packaging Details:
Cartons
Delivery Time:
5-8 work days
Payment Terms:
Payment Terms T/T, Western Union
Supply Ability:
50000 pcs per months
Product Description

Product Description:

The assembly of BGA components is a complex process that requires precision and accuracy. The BGA components have small solder balls that are attached to the underside of the chip. These solder balls make contact with the PCB through a grid of pads that are located on the surface of the board. The BGA chip assembly is then heated so that the solder balls melt and bond with the pads on the PCB.

The BGA PCB Assembly offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, which means that more components can be placed on one circuit board. This reduces the size and weight of the device, making it more compact and portable. The BGA components are also more reliable than other types of components. They have a lower susceptibility to damage from thermal stress and mechanical shock.

The BGA PCB Assembly is a popular choice for electronic manufacturers because it is cost-effective. The BGA components are smaller and require less material to produce, reducing the cost of production. The BGA PCB Assembly is also easier to manufacture because the components are placed on the surface of the board, making it easier to inspect and test.

The BGA PCB Assembly is commonly used in a variety of electronic devices such as laptops, computers, smartphones, and gaming consoles. These devices require a compact and portable design, making the BGA PCB Assembly the perfect choice for manufacturers. The BGA PCB Assembly is also used in medical devices, automotive electronics, and aerospace systems.

In conclusion, the BGA PCB Assembly or Ball Grid Array PCB Assembly is a type of surface mount technology that offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, are more reliable, and are cost-effective. The BGA PCB Assembly is commonly used in electronic devices such as computers, laptops, and smartphones. It is also used in medical devices, automotive electronics, and aerospace systems. The BGA PCB Assembly is the perfect choice for manufacturers who require a compact and portable design.


Features:

  • Product Name: BGA PCB Assembly
  • BGA Printed Circuit Board Assembly
  • BGA Chip Assembly
  • BGA Printed Circuit Board Assembly
  • High-quality components used
  • Advanced manufacturing technology
  • RoHS compliant
  • Customizable design options
  • Fast and efficient assembly process
  • Thorough quality control testing
  • Competitive pricing

Technical Parameters:

Product Attribute Description
Product Name BGA Integrated Circuit Assembly
Product Type BGA Printed Circuit Board Assembly
Assembly Type BGA Electronic Assembly

Applications:


Support and Services:

The BGA PCB Assembly product technical support and services include:

  • Expert technical support from our team of experienced engineers
  • Customized design and assembly solutions to meet your specific requirements
  • Testing and inspection services to ensure product quality and reliability
  • Repair and maintenance services to extend the lifespan of your product
  • Training and education to help you understand and utilize the full capabilities of the product

Our goal is to provide comprehensive support and services to ensure the success of your project and the satisfaction of your customers.


Packing and Shipping:

Product Packaging:

  • The BGA PCB Assembly product will be placed in an anti-static bag.
  • The anti-static bag will then be placed in a cardboard box with foam padding for extra protection.
  • The cardboard box will be sealed with packing tape.

Shipping:

  • The BGA PCB Assembly product will be shipped via a reliable courier service.
  • The shipping cost will be calculated based on the destination and weight of the package.
  • The package will be tracked to ensure safe and timely delivery.

FAQ:

Q: What is the model number of the BGA PCB Assembly product?

A: The model number of our BGA PCB Assembly product is PCBA.

Q: Where is the BGA PCB Assembly product manufactured?

A: Our BGA PCB Assembly product is manufactured in Dongguan, China.

Q: What is the brand name of the BGA PCB Assembly product?

A: The brand name of our BGA PCB Assembly product is CHANLONG.

Q: What certifications does the BGA PCB Assembly product have?

A: Our BGA PCB Assembly product is certified with IATF16949 and ROHS.

Q: What are the packaging details of the BGA PCB Assembly product?

A: The BGA PCB Assembly products are packaged in cartons.

Q: What is the minimum order quantity for the BGA PCB Assembly product?

A: The minimum order quantity for our BGA PCB Assembly product is 100 pieces.

Q: What is the delivery time for the BGA PCB Assembly product?

A: The delivery time for our BGA PCB Assembly product is 5-8 working days.

Q: What are the payment terms for the BGA PCB Assembly product?

A: The payment terms for our BGA PCB Assembly product are T/T and Western Union, and prices are negotiable.


Vacuum packing with silica gel Carton Box with Foam Wooden Box Anti-static Packing

Vacuum packing with silica gel Carton Box with Foam Wooden Box Anti-static Packing

Vacuum packing with silica gel Carton Box with Foam Wooden Box Anti-static Packing

products
PRODUCTS DETAILS
Professional BGA PCB Assembly for Optimal Performance and Reliability
MOQ: 100 piece
Price: negotiations
Standard Packaging: Cartons
Delivery Period: 5-8 work days
Payment Method: Payment Terms T/T, Western Union
Supply Capacity: 50000 pcs per months
Detail Information
Place of Origin
Dongguan
Brand Name
CHANLONG
Certification
IATF16949/ROHS
Model Number
PCBA
Minimum Order Quantity:
100 piece
Price:
negotiations
Packaging Details:
Cartons
Delivery Time:
5-8 work days
Payment Terms:
Payment Terms T/T, Western Union
Supply Ability:
50000 pcs per months
Product Description

Product Description:

The assembly of BGA components is a complex process that requires precision and accuracy. The BGA components have small solder balls that are attached to the underside of the chip. These solder balls make contact with the PCB through a grid of pads that are located on the surface of the board. The BGA chip assembly is then heated so that the solder balls melt and bond with the pads on the PCB.

The BGA PCB Assembly offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, which means that more components can be placed on one circuit board. This reduces the size and weight of the device, making it more compact and portable. The BGA components are also more reliable than other types of components. They have a lower susceptibility to damage from thermal stress and mechanical shock.

The BGA PCB Assembly is a popular choice for electronic manufacturers because it is cost-effective. The BGA components are smaller and require less material to produce, reducing the cost of production. The BGA PCB Assembly is also easier to manufacture because the components are placed on the surface of the board, making it easier to inspect and test.

The BGA PCB Assembly is commonly used in a variety of electronic devices such as laptops, computers, smartphones, and gaming consoles. These devices require a compact and portable design, making the BGA PCB Assembly the perfect choice for manufacturers. The BGA PCB Assembly is also used in medical devices, automotive electronics, and aerospace systems.

In conclusion, the BGA PCB Assembly or Ball Grid Array PCB Assembly is a type of surface mount technology that offers many benefits over other types of PCB assembly. The BGA components have a higher pin density, are more reliable, and are cost-effective. The BGA PCB Assembly is commonly used in electronic devices such as computers, laptops, and smartphones. It is also used in medical devices, automotive electronics, and aerospace systems. The BGA PCB Assembly is the perfect choice for manufacturers who require a compact and portable design.


Features:

  • Product Name: BGA PCB Assembly
  • BGA Printed Circuit Board Assembly
  • BGA Chip Assembly
  • BGA Printed Circuit Board Assembly
  • High-quality components used
  • Advanced manufacturing technology
  • RoHS compliant
  • Customizable design options
  • Fast and efficient assembly process
  • Thorough quality control testing
  • Competitive pricing

Technical Parameters:

Product Attribute Description
Product Name BGA Integrated Circuit Assembly
Product Type BGA Printed Circuit Board Assembly
Assembly Type BGA Electronic Assembly

Applications:


Support and Services:

The BGA PCB Assembly product technical support and services include:

  • Expert technical support from our team of experienced engineers
  • Customized design and assembly solutions to meet your specific requirements
  • Testing and inspection services to ensure product quality and reliability
  • Repair and maintenance services to extend the lifespan of your product
  • Training and education to help you understand and utilize the full capabilities of the product

Our goal is to provide comprehensive support and services to ensure the success of your project and the satisfaction of your customers.


Packing and Shipping:

Product Packaging:

  • The BGA PCB Assembly product will be placed in an anti-static bag.
  • The anti-static bag will then be placed in a cardboard box with foam padding for extra protection.
  • The cardboard box will be sealed with packing tape.

Shipping:

  • The BGA PCB Assembly product will be shipped via a reliable courier service.
  • The shipping cost will be calculated based on the destination and weight of the package.
  • The package will be tracked to ensure safe and timely delivery.

FAQ:

Q: What is the model number of the BGA PCB Assembly product?

A: The model number of our BGA PCB Assembly product is PCBA.

Q: Where is the BGA PCB Assembly product manufactured?

A: Our BGA PCB Assembly product is manufactured in Dongguan, China.

Q: What is the brand name of the BGA PCB Assembly product?

A: The brand name of our BGA PCB Assembly product is CHANLONG.

Q: What certifications does the BGA PCB Assembly product have?

A: Our BGA PCB Assembly product is certified with IATF16949 and ROHS.

Q: What are the packaging details of the BGA PCB Assembly product?

A: The BGA PCB Assembly products are packaged in cartons.

Q: What is the minimum order quantity for the BGA PCB Assembly product?

A: The minimum order quantity for our BGA PCB Assembly product is 100 pieces.

Q: What is the delivery time for the BGA PCB Assembly product?

A: The delivery time for our BGA PCB Assembly product is 5-8 working days.

Q: What are the payment terms for the BGA PCB Assembly product?

A: The payment terms for our BGA PCB Assembly product are T/T and Western Union, and prices are negotiable.


Vacuum packing with silica gel Carton Box with Foam Wooden Box Anti-static Packing

Vacuum packing with silica gel Carton Box with Foam Wooden Box Anti-static Packing

Vacuum packing with silica gel Carton Box with Foam Wooden Box Anti-static Packing

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