About Us
Certificates
-
管理体系证书 -
产品证书 -
产品证书 -
产品证书 -
产品证书 -
产品证书
QC Profile
Excellent management system and certification
Changkeshun Technology is a high-tech enterprise specializing in electronic assembly and processing. The pass rate of
processed products is more than 99.8%. SMT process:components from 0201 and above. QFN and BGA can be pasted
with 0.15 pitch; 5 DIP welding lines with wave soldering processing, lead and lead-free technique can be provided in saparate
workshop; 4 finished product assembly lines.We have passed the ISO9001 quality system certification, so as to fully ensure
that all aspects of the customer's requirements for the product are met;
High requirements, high standards, high quality:
- BGA QFN packaging materials, X-RAY full inspection; AOI inspection
- Use imported solder paste;
- Proofing to do the first prototype inspection;
- 4000 square meters dust-free anti-static constant temperature &humidity workshops
- Technical Support Range
| Max panel size | 32" x 20.5"(800mm x 520mm) | |
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | |
| Min PAD (inner layer) | 5 mil(0.13mm) | |
| Min thickness(inner layer) | 4 mil(0.1mm) | |
| Inner copper thickness | 1~4 oz | |
| Outer copper thickness | 0.5~6 oz | |
| Finished board thickness | 0.4-3.2 mm | |
Board thickness tolerance control |
±0.10 mm | ±0.10 mm |
| ±10% | ±10% | |
| ±10% | ±10% | |
| Inner layer treatment | brown oxidation | |
| Layer count Capability | 1-30 LAYER | |
| alignment between ML | ±2mil | |
| Min drilling | 0.15 mm | |
| Min finished hole | 0.1 mm | |
| Hole precision | ±2 mil(±50 um) | |
| tolerance for Slot | ±3 mil(±75 um) | |
| tolerance for PTH | ±3 mil(±75um) | |
| tolerance for NPTH | ±2mil(±50um) | |
| Max Aspect Ratio for PTH | 8:1 | |
| Hole wall copper thickness | 15-50um | |
| Alignment of outer layers | 4mil/4mil | |
| Min trace width/space for outer layer | 4mil/4mil | |
| Tolerance of Etching | +/-10% | |
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) |
| at trace corner | ≥0.2mil(5um) | |
| On base material | ≤+1.2mil Finished thickness |
|
| Hardness of solder mask | 6H | |
| Alignment of solder mask film | ±2mil(+/-50um) | |
| Min width of solder mask bridge | 4mil(100um) | |
| Max hole with solder plug | 0.5mm | |
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | |
| Max Nickel thickness for Gold finger | 280u"(7um) | |
| Max gold thickness for Gold finger | 30u"(0.75um) | |
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | |
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | |
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | |
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | |
| bow and twist | 0.75% | |