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MOQ: | 100 piece |
Price: | negotiations |
Standard Packaging: | Cartons |
Delivery Period: | 5-8 work days |
Payment Method: | Payment Terms T/T, Western Union |
Supply Capacity: | 50000 pcs per months |
Our BGA PCB Assembly product features advanced technologies that make it possible to mount and solder ball grid array (BGA) packages onto printed circuit boards (PCBs) with high accuracy, consistency, and reliability. This product is ideal for manufacturing electronic products that require complex and high-density circuitry, such as microprocessors, memory modules, and graphics processors.
One of the most significant advantages of our BGA PCB Assembly product is its ability to mount BGA packages onto PCBs with high precision. This is achieved through the use of state-of-the-art equipment, such as automated optical inspection (AOI) systems and X-ray machines, which enable us to inspect and verify the alignment, orientation, and soldering quality of each BGA package. This ensures that the final assembly meets the highest standards of quality and reliability.
Another key feature of our BGA PCB Assembly product is its ability to perform BGA Surface Mount Assembly with exceptional accuracy and consistency. This is made possible through the use of advanced surface-mount technology (SMT) equipment, such as pick-and-place machines and reflow ovens, which enable us to mount BGA packages onto PCBs with high speed and efficiency while maintaining excellent precision and quality.
Our BGA PCB Assembly product also includes BGA Soldering Assembly services, which involve the use of advanced soldering techniques and materials to ensure that the BGA packages are securely and reliably attached to the PCBs. We use a variety of soldering methods, including reflow soldering, wave soldering, and hand soldering, depending on the specific requirements of each project.
In addition to its advanced technologies and capabilities, our BGA PCB Assembly product is backed by a team of highly skilled and experienced engineers and technicians who are committed to providing excellent customer service and support. We work closely with our clients to understand their specific needs and requirements, and we strive to deliver customized solutions that meet or exceed their expectations.
Whether you are a small startup or a large corporation, our BGA PCB Assembly product can help you achieve your electronic assembly goals with speed, precision, and quality. Contact us today to learn more about our BGA Mounting System Assembly, BGA Surface Mount Assembly, and BGA Soldering Assembly services.
Product Name: | Ball Grid Array PCB Assembly |
Assembly Type: | BGA Soldering Assembly |
Electronic Components: | BGA Electronic Assembly |
PCB Layers: | 2-8 Layers |
PCB Thickness: | 0.4mm-4.0mm |
Minimum Drill Hole Size: | 0.2mm |
Minimum Line Width/Spacing: | 0.1mm/0.1mm |
Solder Mask Color: | Green, Red, Blue, Yellow, Black, White |
The BGA PCB Assembly is commonly used in electronic devices such as computers, mobile phones, and other related devices. This product is popularly used for BGA Soldering Assembly, BGA Surface Mount Assembly, and BGA Chip Assembly. The BGA PCB Assembly is designed to provide exceptional performance and reliability, making it a preferred choice for many manufacturers.
The CHANLONG BGA PCB Assembly is certified under IATF16949 and ROHS, ensuring that this product meets the required quality standards. Additionally, this product is packaged in cartons, which ensures that it is protected during transportation. The supply ability for this product is 50000 pcs per month, making it readily available to meet the needs of different industries and manufacturers.
The price of the CHANLONG BGA PCB Assembly is negotiable, and the minimum order quantity is 100 pieces. The delivery time for this product is 5-8 work days, making it a fast and reliable option for manufacturers. Payment terms for this product are T/T and Western Union, providing flexibility and convenience to customers.
The CHANLONG BGA PCB Assembly is suitable for various product application occasions and scenarios. It is perfect for use in consumer electronics, automotive devices, medical equipment, and other industries. This product is suitable for BGA Soldering Assembly, BGA Surface Mount Assembly, and BGA Chip Assembly, making it a versatile option for manufacturers.
In conclusion, the CHANLONG BGA PCB Assembly is a reliable and high-quality product that is widely used in various industries. It meets required quality standards, is readily available, and is suitable for various product application occasions and scenarios. Manufacturers can trust this product to provide exceptional performance and reliability, making it a preferred choice for many.
Our BGA PCB Assembly product comes with comprehensive technical support and services to ensure maximum performance and reliability. Our team of experienced technicians is available to assist with any issues related to the product, including installation, configuration, and troubleshooting. We also offer ongoing maintenance and support services to keep the product operating at peak efficiency over its lifespan.
Our technical support and services include:
With our technical support and services, you can feel confident in the performance and reliability of our BGA PCB Assembly product.
Product Packaging:
Shipping:
Q: What is the model number of the BGA PCB Assembly product?
A: The model number of the BGA PCB Assembly product is PCBA.
Q: Where is the BGA PCB Assembly product manufactured?
A: The BGA PCB Assembly product is manufactured in Dongguan.
Q: What is the brand name of the BGA PCB Assembly product?
A: The brand name of the BGA PCB Assembly product is CHANLONG.
Q: What certifications does the BGA PCB Assembly product have?
A: The BGA PCB Assembly product is certified with IATF16949/ROHS.
Q: What is the delivery time for the BGA PCB Assembly product?
A: The delivery time for the BGA PCB Assembly product is 5-8 work days.
![]() |
MOQ: | 100 piece |
Price: | negotiations |
Standard Packaging: | Cartons |
Delivery Period: | 5-8 work days |
Payment Method: | Payment Terms T/T, Western Union |
Supply Capacity: | 50000 pcs per months |
Our BGA PCB Assembly product features advanced technologies that make it possible to mount and solder ball grid array (BGA) packages onto printed circuit boards (PCBs) with high accuracy, consistency, and reliability. This product is ideal for manufacturing electronic products that require complex and high-density circuitry, such as microprocessors, memory modules, and graphics processors.
One of the most significant advantages of our BGA PCB Assembly product is its ability to mount BGA packages onto PCBs with high precision. This is achieved through the use of state-of-the-art equipment, such as automated optical inspection (AOI) systems and X-ray machines, which enable us to inspect and verify the alignment, orientation, and soldering quality of each BGA package. This ensures that the final assembly meets the highest standards of quality and reliability.
Another key feature of our BGA PCB Assembly product is its ability to perform BGA Surface Mount Assembly with exceptional accuracy and consistency. This is made possible through the use of advanced surface-mount technology (SMT) equipment, such as pick-and-place machines and reflow ovens, which enable us to mount BGA packages onto PCBs with high speed and efficiency while maintaining excellent precision and quality.
Our BGA PCB Assembly product also includes BGA Soldering Assembly services, which involve the use of advanced soldering techniques and materials to ensure that the BGA packages are securely and reliably attached to the PCBs. We use a variety of soldering methods, including reflow soldering, wave soldering, and hand soldering, depending on the specific requirements of each project.
In addition to its advanced technologies and capabilities, our BGA PCB Assembly product is backed by a team of highly skilled and experienced engineers and technicians who are committed to providing excellent customer service and support. We work closely with our clients to understand their specific needs and requirements, and we strive to deliver customized solutions that meet or exceed their expectations.
Whether you are a small startup or a large corporation, our BGA PCB Assembly product can help you achieve your electronic assembly goals with speed, precision, and quality. Contact us today to learn more about our BGA Mounting System Assembly, BGA Surface Mount Assembly, and BGA Soldering Assembly services.
Product Name: | Ball Grid Array PCB Assembly |
Assembly Type: | BGA Soldering Assembly |
Electronic Components: | BGA Electronic Assembly |
PCB Layers: | 2-8 Layers |
PCB Thickness: | 0.4mm-4.0mm |
Minimum Drill Hole Size: | 0.2mm |
Minimum Line Width/Spacing: | 0.1mm/0.1mm |
Solder Mask Color: | Green, Red, Blue, Yellow, Black, White |
The BGA PCB Assembly is commonly used in electronic devices such as computers, mobile phones, and other related devices. This product is popularly used for BGA Soldering Assembly, BGA Surface Mount Assembly, and BGA Chip Assembly. The BGA PCB Assembly is designed to provide exceptional performance and reliability, making it a preferred choice for many manufacturers.
The CHANLONG BGA PCB Assembly is certified under IATF16949 and ROHS, ensuring that this product meets the required quality standards. Additionally, this product is packaged in cartons, which ensures that it is protected during transportation. The supply ability for this product is 50000 pcs per month, making it readily available to meet the needs of different industries and manufacturers.
The price of the CHANLONG BGA PCB Assembly is negotiable, and the minimum order quantity is 100 pieces. The delivery time for this product is 5-8 work days, making it a fast and reliable option for manufacturers. Payment terms for this product are T/T and Western Union, providing flexibility and convenience to customers.
The CHANLONG BGA PCB Assembly is suitable for various product application occasions and scenarios. It is perfect for use in consumer electronics, automotive devices, medical equipment, and other industries. This product is suitable for BGA Soldering Assembly, BGA Surface Mount Assembly, and BGA Chip Assembly, making it a versatile option for manufacturers.
In conclusion, the CHANLONG BGA PCB Assembly is a reliable and high-quality product that is widely used in various industries. It meets required quality standards, is readily available, and is suitable for various product application occasions and scenarios. Manufacturers can trust this product to provide exceptional performance and reliability, making it a preferred choice for many.
Our BGA PCB Assembly product comes with comprehensive technical support and services to ensure maximum performance and reliability. Our team of experienced technicians is available to assist with any issues related to the product, including installation, configuration, and troubleshooting. We also offer ongoing maintenance and support services to keep the product operating at peak efficiency over its lifespan.
Our technical support and services include:
With our technical support and services, you can feel confident in the performance and reliability of our BGA PCB Assembly product.
Product Packaging:
Shipping:
Q: What is the model number of the BGA PCB Assembly product?
A: The model number of the BGA PCB Assembly product is PCBA.
Q: Where is the BGA PCB Assembly product manufactured?
A: The BGA PCB Assembly product is manufactured in Dongguan.
Q: What is the brand name of the BGA PCB Assembly product?
A: The brand name of the BGA PCB Assembly product is CHANLONG.
Q: What certifications does the BGA PCB Assembly product have?
A: The BGA PCB Assembly product is certified with IATF16949/ROHS.
Q: What is the delivery time for the BGA PCB Assembly product?
A: The delivery time for the BGA PCB Assembly product is 5-8 work days.