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Automotive navigation board chip processing is a precise and critical manufacturing process, its process covers a number of rigorous steps.
The first is the solder paste printing link, the high-precision solder paste press will paste evenly on the solder pad of the circuit board. This step requires the press to accurately control the thickness, position and amount of the solder paste, because the state of the solder paste directly affects the subsequent welding quality.
Next is the placement process, the advanced placement machine according to the pre-set program, from the feeder to grab resistor, capacitor, chip and other small surface mount components, and then placed them in the solder paste coated circuit board with high precision. The speed and positioning accuracy of the mounter are crucial to ensure that each component can be correctly placed.
After the placement is completed, the reflow welding stage is entered, and the circuit board containing the components is fed into the reflow furnace. The furnace is heated according to a specific temperature curve, the solder paste is heated and melted, and the components and the circuit board are solidly welded together. Precise control of temperature and time is the key to this link, too high temperature or too long time may damage the components, otherwise it will lead to poor welding.
The final part is the inspection process, through automatic optical inspection (AOI) equipment to conduct a comprehensive inspection of the welded motherboard, identifying welding defects such as missing parts, offset, short circuit and so on. For the detected problem products, manual repair or rework processing will be carried out to ensure that each piece of the vehicle navigator motherboard meets high quality standards, providing reliable protection for subsequent installation and use.
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Automotive navigation board chip processing is a precise and critical manufacturing process, its process covers a number of rigorous steps.
The first is the solder paste printing link, the high-precision solder paste press will paste evenly on the solder pad of the circuit board. This step requires the press to accurately control the thickness, position and amount of the solder paste, because the state of the solder paste directly affects the subsequent welding quality.
Next is the placement process, the advanced placement machine according to the pre-set program, from the feeder to grab resistor, capacitor, chip and other small surface mount components, and then placed them in the solder paste coated circuit board with high precision. The speed and positioning accuracy of the mounter are crucial to ensure that each component can be correctly placed.
After the placement is completed, the reflow welding stage is entered, and the circuit board containing the components is fed into the reflow furnace. The furnace is heated according to a specific temperature curve, the solder paste is heated and melted, and the components and the circuit board are solidly welded together. Precise control of temperature and time is the key to this link, too high temperature or too long time may damage the components, otherwise it will lead to poor welding.
The final part is the inspection process, through automatic optical inspection (AOI) equipment to conduct a comprehensive inspection of the welded motherboard, identifying welding defects such as missing parts, offset, short circuit and so on. For the detected problem products, manual repair or rework processing will be carried out to ensure that each piece of the vehicle navigator motherboard meets high quality standards, providing reliable protection for subsequent installation and use.
